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Design + Simulation + AI: Building Smarter Electronics with an Integrated Ecosystem

  • 5 hours ago
  • 4 min read

As electronic systems become more complex with high higher speeds, higher frequencies, tighter power budgets, and shorter development cycles, traditional and siloed design approaches are no longer sufficient. Today’s engineers need integrated design and simulation workflows, supported facilitated augmented by AI-driven intelligence, to make better decisions earlier in the design cycle.


Braemac stands at the forefront of component expertise, advanced EDA tools, and hands-on engineering support. As a leading global electronic component supplier and authorized distributor of Cadence® solutions, Braemac enables customers to move seamlessly from concept to production using a unified Design + Simulation + AI approach.


Braemac’s Engineering-First Approach

Braemac is more than a component distributor. Our unique value-added distribution model enables developers to achieve their engineering goals with confidence by combining the right components, tools, and technical insight.


Leveraging a comprehensive in-house team of technical experts, our Field Application Engineers support customers across a broad range of industries including Defence, Industrial, Medical, Automotive, IoT, and more. Collaborating closely with design teams from early on in design phases through validation and production reduces risk, optimises performance, and ultimately accelerates time-to-market.


How Synergizing Design and Simulation Reduces Risk

Modern electronics designs demand simultaneous design and simulation. Cadence offers a wide portfolio of solutions, available at Braemac, that teams can use to access an end-to-end design and analysis flow:

Source: Cadence
Source: Cadence

  • PCB Design: OrCAD X and Allegro X enable constraint-driven schematic capture and PCB layout, ensuring electrical, manufacturing, and reliability requirements are met from day one.

  • RF Design & EM Analysis: AWR, AXIEM and Clarity deliver accurate planar and 3D EM simulation for antennas, RF passives, and high-frequency structures which are critical for wireless and high-speed designs.

  • Signal & Power Integrity: Sigrity provide advanced SI/PI allowing designers to identify noise, crosstalk, and power delivery issues early - before costly board spins.

  • Electro-thermal Analysis: Celsius Thermal Solver provides comprehensive electro-thermal analysis allowing designers to evaluate thermal behaviour early before any late-stage thermal surprise.


By embedding simulation into the design flow, engineers can validate decisions as they design which Cadence calls as its Shift left approach.


AI in Electronic Design Enables Smarter Decisions, Faster

AI is rapidly transforming EDA workflows. AI-assisted routing, constraint optimisation, and predictive analysis help engineers explore more design possibilities in less time.


Rather than replacing engineering judgement, AI enhances it and allows designers to:

  • Identify potential issues earlier

  • Optimise layouts automatically based on learned design patterns

  • Focus engineering effort on innovation instead of repetitive tasks


The Cadence ChipStack AI Super Agent is the world’s first AI-powered silicon agent capable of autonomously generating and verifying designs directly from specifications and high-level descriptions. Purpose-built for test and measurement workflows, the ChipStack AI Super Agent delivers up to 10x productivity gains across coding design and test benches, creating test plans, orchestrating regression testing, debugging, and automatically resolving issues.


Developed using Cadence’s unique Intelligent System Design™ methodology, which unifies AI-driven simulation, advanced acceleration, and optimized computing, this agentic AI solution seamlessly integrates with existing Cadence AI optimization frameworks and AI-assistant tools. The ChipStack AI Super Agent also supports both cloud-based and on-premises frontier models, enabling the use of open platforms like NVIDIA Nemotron.


Cadence Image
Source: Cadence

Top 4 Advantages to Integrating Silicon Innovation in Designs

One of Braemac’s strongest differentiators is the synergy between EDA tools and semiconductor solutions. By combining Cadence design and simulation tools with Braemac’s extensive chip line card, including Renesas, Silicon Labs, Microchip, and others, our customers gain a truly system-level design advantage.


1. Component-Aware Design from Day One

Effective design starts with the informed silicon selection. Braemac engineers help teams select microcontrollers (MCUs), System-on-Chip (SoC), power devices, and RF components early in the process, feeding real-world device models and characteristics directly into Cadence design and simulation environments for more accurate behaviour, constraints and system trade-offs.


2. Reference Designs + Simulation-Driven Validation

Many semiconductor vendors provide reference designs, but Braemac transforms them into project-ready assets by:

  • Adapting reference designs to customer-specific requirements

  • Simulating power integrity, signal integrity, and RF performance using Cadence tools

  • Identifying layout sensitivities and performance limits before hardware is built


3. PCB & Package Optimisation for Specific Devices

High-speed MCUs, RF transceivers, and power devices demand layout aware engineering. Using Allegro X, Sigrity, Celsius, AXIEM, and Clarity, Braemac supports customers in:

  • Optimising PCB stackups for selected silicon

  • Validating high-speed interfaces (DDR, SERDES, Ethernet)

  • Ensuring RF performance meets datasheet and regulatory requirements


4. Faster Bring-Up with Fewer Board Spins

By aligning component selection, design constraints, and simulation results, Braemac partners benefit from:

  • Reduced prototype iterations

  • Faster bring-up and debugging

  • Higher first-pass success rates


Move Confidently from Concept to Production with Braemac as a Trusted Design Partner


By combining Cadence EDA technologies, AI-enabled workflows, and deep semiconductor expertise, Braemac’s unique offer transcends simple tools and components in isolation to delivers a cohesive design ecosystem.


Whether customers are developing high-speed digital systems, RF designs, or complex mixed-signal platforms, Braemac helps bridge the gap between theoretical design and real-world performance. Design complexity will only continue to increase. Success depends on how well design, simulation, AI, and component selection are integrated.


Engage with Braemac to explore:

  • Design and simulation tool demonstrations

  • Component-optimised design workflows

  • Proof-of-concept and early-stage validation support


Together, we help turn complex ideas into reliable, production-ready products. Contact info@Braemac.com to get started today.


Cadence Image


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