RA2E1 MCUs use the Arm® Cortex®-M23 core operating up to 48 MHz and are supported by the easy-to-use Flexible Software Package (FSP) and Renesas’ Partner Ecosystem, which offers software and hardware building block solutions that work out-of-the-box and speed time to market. The RA2E1 MCUs support a wide operating voltage range of 1.6V to 5.5V and a large selection of packages such as LQFP, QFN, LGA, BGA, and Wafer Level Chip Scale Package (WLCSP).
With optimized combinations of superior performance, ultra-low-power consumption, innovative peripherals, and small package options, the RA2E1 MCU Group is ideal for cost-sensitive applications and space-constrained applications, such as consumer products, appliances, and industrial equipment. The new MCUs offer an upgrade path with hardware and software scalability, so they are the perfect entry point into the wide line-up of the Renesas RA Family.
Key Features of the RA2E1 MCU Group:
48 MHz Arm Cortex-M23 CPU core
Integrated Flash memory options from 32KB to 128KB; and 16KB RAM
Support for wide operating voltage range: 1.6V - 5.5V
Pin counts from 25-pin to 64-pin
Package options including LQFP, QFN, LGA, BGA and WLCSP (2.14 x 2.27mm)
Low power operation: 100µA/MHz in active mode; 250nA in software standby
Integrated next generation innovative capacitive touch sensing unit with no external components required, lowering BOM costs
Enables system costs reduction with on-chip peripheral functions, including a high precision (1.0%) internal oscillator, background operation data flash supporting 1 million erase/program cycles, high-current IO ports, and a temperature sensor
Pin and peripheral compatibility with RA2L1 Group devices for quick and easy upgrade paths
The RA2E1 MCUs can be combined with Renesas’ complementary analog and power offerings to create comprehensive solutions for a variety of applications.