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Compact Computer-on-Module Power and Design for IoT with Limitless Potential

ADLINK Open Standard Modules

The ADLINK OSM (Open Standard Module) form factor is smaller, compact version than previous standards like Qseven and SMARC, enhancing existing solutions, offering greater miniaturization and interface flexibility. OSM modules are also completely machine processible during soldering, assembly and testing.



  • Compact Design: Both the OSM-IMX8MP and OSM-IMX93 are the first Computer-on-Modules designed for solderable BGA mini modules, accommodating ARM and x86 designs within a compact 45mm x 45mm size. With up to 662 BGA pins, it allows for multiple interfaces in a confined space, ideal for IoT (Internet of Things) applications.

  • CPU Performance: The OSM-IMX8MP has an integrated NXP® i.MX8M Plus series processor with 4-core Arm Cortex-A53 & M7 while the OSM-IMX93 features a NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33.

  • Memory and Storage: Up to 2GB LPDDR4 memory (128 GB eMMC storage) and 8GB LPDDR4 memory (128 GB eMMC storage).

  • Graphics Output: The OSM-IMX8MP module supports HDMI, LVDS and DSI while the OSM-IMX93 module supports LVDS and DSI graphic output interfaces, both with 15-year product availability.

Key Applications:

  • Edge AI

  • IoT

  • Robotics

Known for high safety standards with a separate security island and available with rugged operating temperature options (-40°C to 85°C), both the ADLINK IMX8MP and IMX93 are ideal for edge solutions and various AI applications including on-device AI processing at ultra-low power.

For further details, contact today to learn more


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